Philip McKay is the chair of the patent and intellectual property and internet groups. Prior to joining Hawley Troxell, Mr. McKay founded McKay & Hodgson, LLP, a patent firm in Monterey, California, and was senior patent counsel for a Fortune 100 Corporation. In maintaining some of the largest patent portfolios in Silicon Valley, Mr. McKay has prepared and prosecuted hundreds of domestic and foreign patent applications. With over 20 years of experience, he helps clients achieve strategic business objectives, authors non-infringement and validity opinions, and provides strategic technology licensing and portfolio management counseling to numerous companies throughout the technology sector.
In addition, as corporate patent counsel, Mr. McKay helped establish the patent program, policies, and procedures used by a Fortune 100 Corporation to create one of the largest patent portfolios in the Silicon Valley. He has also taken part in technology licensing negotiations involving companies ranging from small start-ups to some of the most well-known corporations in the world.
Mr. McKay is licensed to practice law in California, Washington, The District of Columbia, and before the USPTO.
LAW SCHOOL: University of Southern California Gould School of Law, J.D., 1993
USC Tax and Interdisciplinary Law Journal, Editor and Senior Editor
UNDERGRADUATE: University of California, Los Angeles, B.S., Physics, cum laude, 1990
Veterans of Foreign Wars
Cloud-based architecture, security, and services; SIEM; cloud implemented financial management and highly sensitive data processing architectures; cluster computing; distributed storage systems; “Big Data” processing, utilization, visualization and monitoring; artificial intelligence and machine learning; boundlessness multiple platform MFA systems; IOT; user experience and customer retention/acquisition; general software applications and systems; mobile applications and infrastructure; business methods; platform/software as a service systems; microprocessor architecture and design; traditional and low power circuit design and fabrication; solid-state memory system design; wafer scale design and fabrication; IC packaging; computing system architecture; LASER and optical devices and infrared LASER sighting systems; peripheral devices and drivers; video compression; refrigeration/heat dissipation technology; mechanical devices; and medical devices.